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Electronic Adhesive Solutions: Precision Bonding, Reliable Protection
Focused on High-End Electronics Manufacturing Bonding Needs
We offer a professional range of electronic adhesives, providing high-reliability, high-performance bonding, sealing, and protection solutions for electronic products. Our solutions are precisely tailored to meet stringent process requirements and cover all critical stages of electronics manufacturing.
Core Products & Applications:
PUR Hot Melt Adhesives: Fast curing, ideal for automated production lines such as wire harness fixation, sensor encapsulation, and speaker assembly.
OLED Module Frame Adhesives: Designed for flexible and rigid OLEDs, offering excellent adhesion, weather resistance, and stress buffering to ensure display quality.
Conformal Coatings: Precision spray or dip coatings providing triple protection against moisture, salt spray, and corrosion for PCBA.
Underfill Adhesives: Enhance drop, impact, and thermal fatigue resistance of BGA, CSP, and other chips, improving overall reliability.
Two-Component Structural Adhesives: High-strength bonding for housings, bracket fixation, and heat sink attachment, suitable for areas exposed to mechanical stress.
Our Core Values:
High Reliability: Ensure long-term stable operation of electronic devices and reduce failure rates.
Precision Process Adaptation: Compatible with dispensing, spraying, and filling processes.
Excellent Protective Performance: Effectively resist environmental stresses including temperature, humidity, chemicals, and mechanical impacts.
Broad Material Compatibility: Suitable for metals, plastics, glass, ceramics, and more.
Compliant with Electronics Industry Environmental Standards
Choose us for comprehensive and reliable electronic bonding and protection solutions!
